Dust Particle Properties in a Dual-Frequency Driven Sheath
LIU Yu, DAI Zhong-Ling, WANG You-Nian
State Key Laboratory of Materials Modification by Laser, Electron, and Ion Beams, School of Physics and Optoelectronic Technology, Dalian University of Technology, Dalian 116023
Dust Particle Properties in a Dual-Frequency Driven Sheath
LIU Yu;DAI Zhong-Ling;WANG You-Nian
State Key Laboratory of Materials Modification by Laser, Electron, and Ion Beams, School of Physics and Optoelectronic Technology, Dalian University of Technology, Dalian 116023
摘要We study characteristics of a single dust particle in a dual-frequency capacitively coupled plasma sheath, such as charging and suspending processes, using a collisionless self-consistent model. Also, the movement of the dust grain with time is investigated for the various radii and initial velocities. The numerical results show that, after several microseconds, the charging process of the dust particle reaches equilibrium, and the grain obtains its equilibrium position, In addition, it is found that the parameters of the low-frequency source impact on the charging and suspending processes of the dust grain significantly.
Abstract:We study characteristics of a single dust particle in a dual-frequency capacitively coupled plasma sheath, such as charging and suspending processes, using a collisionless self-consistent model. Also, the movement of the dust grain with time is investigated for the various radii and initial velocities. The numerical results show that, after several microseconds, the charging process of the dust particle reaches equilibrium, and the grain obtains its equilibrium position, In addition, it is found that the parameters of the low-frequency source impact on the charging and suspending processes of the dust grain significantly.
LIU Yu;DAI Zhong-Ling;WANG You-Nian. Dust Particle Properties in a Dual-Frequency Driven Sheath[J]. 中国物理快报, 2008, 25(4): 1372-1375.
LIU Yu, DAI Zhong-Ling, WANG You-Nian. Dust Particle Properties in a Dual-Frequency Driven Sheath. Chin. Phys. Lett., 2008, 25(4): 1372-1375.
[1] Boyle P C, Robiche J and Turner M M 2004 J. Phys. D:Appl. Phys. 37 1451 [2] Shannon S, Hoffman D, Yang J G, Paterson A and Holland J2005 J. Appl. Phys. 97 103304 [3] Nitter T 1996 Plasma Sources Sci. Technol. 593 [4] Barnes M S, Keller J H, Forster J C, O'Neill J A andCoultas D K 1992 Phys. Rev. Lett. 68 313 [5] Epstein P S 1924 Phys. Rev. 23 71 [6] Allen J E 1992 Physica Scripta 45 497 [7] Edelberg E A and Aydil E S 1999 J. Appl. Phys. 86 4799 [8] Zhen Q G, Dai Z L and Wang Y N 2005 Phys. Plasmas 12 123502 [9] Kim H C and Manousiouthakis V I 1998 J. Vac. Sci.Technol. A 16 2162 [10] Wu J J and Miller R J 1990 J. Appl. Phys. 671051