Solid/Liquid Interface of Ag/Sn/Ag Trilayers by In Situ Resistivity Measurement
ZHAO Jian-hua1,2, LIU Ri-ping1, ZHANG Xiang-yi1, CAO Li-min2, ZHANG Ming1, HE Duan-wei1, DAI Dao-yang1, XU Ying-fan1, WANG Wen-kui1,2
1Institute of Physics, Chinese Academy of Sciences, Beijing 100080
2Institute of Materials Science and Engineering, Yanshan University, Qinhuangdao 066004
Solid/Liquid Interface of Ag/Sn/Ag Trilayers by In Situ Resistivity Measurement
1Institute of Physics, Chinese Academy of Sciences, Beijing 100080
2Institute of Materials Science and Engineering, Yanshan University, Qinhuangdao 066004
Abstract： The in situ four-point probe resistivity measurement was used as a main method to study the solid/liquid interfacial characteristics in Ag/Sn/Ag trilayers at temperatures ranging from 150 to 305°C. It is found from the variation of resistivity that three processes take place on annealing: the dissolution of silver atoms, the diffusion of silver atoms, and the formation of Ag3Sn in liquid tin layer. The first one plays the leading role in the variation of resistivity during annealing process. The apparent diffusivity of silver in liquid tin at 305°C is determined to be 7.3×10-17cm2/s.
1998, Vol. 15 
