| Original Articles |
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Apparatus for Real-Time Measurement of Stress in Thin Films at
Elevated Temperatures |
| AN Bing;ZHANG Tong-Jun;YUAN Chao;CUI Kun |
| State Key Laboratory of Plastic Forming Simulation and Die
and Mould Technology, Huazhong University of Science and Technology, Wuhan 430074 |
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| Cite this article: |
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AN Bing, ZHANG Tong-Jun, YUAN Chao et al 2003 Chin. Phys. Lett. 20 1387-1389 |
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Abstract As a prerequisite of biaxial zero creep experiments, a novel sensitive apparatus is developed for real-time film-stress measurement during thermal cycles. The optical sensor with a fixed multi-beam emitter and a CCD detector is investigated during an annealing process of Ag/Co multilayer thin film. The monitoring plots of stress as functions of temperature and time demonstrate the capability of this set-up. The typical sensitivity for measuring the wafer curvature radius is 2km.
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| Keywords:
81.70.Fy
68.60.Bs
68.60.Dv
42.87.-d
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Published: 01 August 2003
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| PACS: |
81.70.Fy
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(Nondestructive testing: optical methods)
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68.60.Bs
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(Mechanical and acoustical properties)
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68.60.Dv
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(Thermal stability; thermal effects)
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42.87.-d
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(Optical testing techniques)
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