Chin. Phys. Lett.  2018, Vol. 35 Issue (5): 056802    DOI: 10.1088/0256-307X/35/5/056802
CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
Improvement of Nickel-Stanogermanide Contact Properties by Platinum Interlayer
Wei-Jun Wan1,2, Wei Ren1**, Xiao-Ran Meng2,3, Yun-Xia Ping3, Xing Wei2, Zhong-Ying Xue2, Wen-Jie Yu2, Miao Zhang2, Zeng-Feng Di2, Bo Zhang2**
1Physics Department, Materials Genome Institute, and International Centre for Quantum and Molecular Structures, Shanghai University, Shanghai 200444
2State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050
3School of Mathematics, Physics and Statistics, Shanghai University of Engineering Science, Shanghai 201600
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Wei-Jun Wan, Wei Ren, Xiao-Ran Meng et al  2018 Chin. Phys. Lett. 35 056802
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Abstract We report an effective method to improve the formation of nickel stanogermanide (NiGeSn) by the incorporation of a platinum (Pt) interlayer. After the Ni/Pt/GeSn samples are annealed we obtain uniform NiGeSn thin films, which are characterized by means of sheet resistance, atomic force microscopy, scanning electron microscopy, cross-section transmission electron microscopy, and energy dispersive x-ray spectroscopy. These results show that the presence of Pt increases the smoothness and uniform morphology of NiGeSn films.
Received: 25 December 2017      Published: 30 April 2018
PACS:  68.60.Dv (Thermal stability; thermal effects)  
  68.35.Ct (Interface structure and roughness)  
  68.55.J- (Morphology of films)  
  68.37.-d (Microscopy of surfaces, interfaces, and thin films)  
Fund: Supported by the National Natural Science Foundation of China under Grant Nos 51672171 and 61604094, the Natural Science Foundation of Shanghai under Grant No 14ZR1418300, the National Key Basic Research Program of China under Grant No 2015CB921600, the Eastern Scholar Program from the Shanghai Municipal Education Commission, and the Fok Ying Tung Education Foundation.
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https://cpl.iphy.ac.cn/10.1088/0256-307X/35/5/056802       OR      https://cpl.iphy.ac.cn/Y2018/V35/I5/056802
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Wei-Jun Wan
Wei Ren
Xiao-Ran Meng
Yun-Xia Ping
Xing Wei
Zhong-Ying Xue
Wen-Jie Yu
Miao Zhang
Zeng-Feng Di
Bo Zhang
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