| CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
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Characterization of Obtuse Triangular Defects on 4H-SiC 4° off-Axis Epitaxial Wafers |
| DONG Lin1**, SUN Guo-Sheng1,2, YU Jun2, ZHENG Liu1, LIU Xing-Fang1, ZHANG Feng1, YAN Guo-Guo1, LI Xi-Guang2, WANG Zhan-Guo1, YANG Fei3 |
1Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083
2Dongguan Tianyu Semiconductor, Inc., Dongguan 523000
3State Grid Smart Grid Research Institute, Beijing 100192
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| Cite this article: |
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DONG Lin, SUN Guo-Sheng, YU Jun et al 2013 Chin. Phys. Lett. 30 096105 |
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Abstract We investigate the triangular defects with different structural features on 4H-SiC epilayers by a Nomarski microscope, a Candela optical surface analyzer and ultraviolet photoluminescence (UV-PL) imaging. Both the foreign particles and the substrate scratches can cause the formation of the obtuse triangular defects. The central area of some obtuse triangular defects can have the spatially confined core, in which the in-grown stacking faults can be observed under the UV-PL imaging. In contrast, the obtuse triangular defects induced by the scratches appear in the form of band-like defects, of which the width depends on the scratch direction and reaches the maximum when the scratch direction is parallel to the step flow direction. The formation mechanisms of these obtuse triangular defects are discussed.
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Received: 02 May 2013
Published: 21 November 2013
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| PACS: |
61.72.-y
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(Defects and impurities in crystals; microstructure)
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68.35.Dv
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(Composition, segregation; defects and impurities)
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71.20.Nr
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(Semiconductor compounds)
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