Chin. Phys. Lett.  2012, Vol. 29 Issue (3): 038301    DOI: 10.1088/0256-307X/29/3/038301
CROSS-DISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY |
Chemical Mechanical Polishing of Ge2Sb2Te5 Using Abrasive-Free Solutions of Iron Trichloride
YAN Wei-Xia**, WANG Liang-Yong, ZHANG Ze-Fang, HE Ao-Dong, ZHONG Min, LIU Wei-Li, WU Liang-Cai, SONG Zhi-Tang
State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050
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ZHONG Min, ZHANG Ze-Fang, YAN Wei-Xia et al  2012 Chin. Phys. Lett. 29 038301
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Abstract Chemical mechanical polishing (CMP) of amorphous Ge2Sb2Te5 (GST) is studied using aqueous solutions of iron trichloride (FeCl3) as possible abrasive-free slurries. The polishing performance of abrasive-free solutions is compared with abrasive-containing (3wt% colloidal silica) slurry in terms of polishing rate and surface quality. The experimental results indicate that the abrasive-free solutions have a higher polishing rate and better surface quality. In order to further investigate the polishing mechanism, post-CMP GST films using the abrasive-free solutions and abrasive-containing slurry are characterized by x-ray photoelectron spectroscopy. Finally, it is verified that the abrasive-free solutions have no influence on the electrical property of the post-CMP GST films through the resistivity test.
Keywords: 83.50.jf     
Received: 16 October 2011      Published: 11 March 2012
PACS:  83.50.Jf (Extensional flow and combined shear and extension)  
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https://cpl.iphy.ac.cn/10.1088/0256-307X/29/3/038301       OR      https://cpl.iphy.ac.cn/Y2012/V29/I3/038301
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ZHONG Min
ZHANG Ze-Fang
YAN Wei-Xia
WU Liang-Cai
WANG Liang-Yong
SONG Zhi-Tang
LIU Wei-Li
HE Ao-Dong
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