Chin. Phys. Lett.  2012, Vol. 29 Issue (11): 118501    DOI: 10.1088/0256-307X/29/11/118501
CROSS-DISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY |
High Sensitivity Magnetic Field Sensors Based on Nano-Polysilicon Thin-Film Transistors
ZHAO Xiao-Feng, WEN Dian-Zhong**, ZHUANG Cui-Cui, LIU Gang, WANG Zhi-Qiang
Key Laboratory of Electronics Engineering, College of Heilongjiang Province, Heilongjiang University, Harbin 150080
Cite this article:   
ZHAO Xiao-Feng, WEN Dian-Zhong, ZHUANG Cui-Cui et al  2012 Chin. Phys. Lett. 29 118501
Download: PDF(761KB)  
Export: BibTeX | EndNote | Reference Manager | ProCite | RefWorks
Abstract A high-sensitivity magnetic field sensor based on the nano-polysilicon thin film transistors is proposed to adopt the nano-polysilicon thin films and the nano-polysilicon/single silicon heterojunction interfaces as the sensing layers. By using CMOS technology, the fabrication of the nano-polysilicon thin film transistors with Hall probes can be achieved on the ?100? high resistivity single silicon substrates, in which the thicknesses of the nano-polysilicon thin films are 120 nm and the length width ratio of the channel is 320 μm /80 μm . When VDS=5.0 V, the magnetic sensitivity and linearity is 264 mV/T and 0.23%f.s. (full scale), respectively. The experimental results show that the magnetic sensors based on nano-polysilicon thin film transistors with Hall probes exhibit high sensitivity.
Received: 08 August 2012      Published: 28 November 2012
PACS:  85.75.Nn (Hybrid Hall devices)  
  85.30.De (Semiconductor-device characterization, design, and modeling)  
  85.30.Tv (Field effect devices)  
TRENDMD:   
URL:  
https://cpl.iphy.ac.cn/10.1088/0256-307X/29/11/118501       OR      https://cpl.iphy.ac.cn/Y2012/V29/I11/118501
Service
E-mail this article
E-mail Alert
RSS
Articles by authors
ZHAO Xiao-Feng
WEN Dian-Zhong
ZHUANG Cui-Cui
LIU Gang
WANG Zhi-Qiang
[1] Gallagher R C, Corak W S 1966 Solid-State Electron. 9 571
[2] Bihan F L, Carvou E, Fortin B, Rogel R, Salaün A C and Bonnaud O 2001 Sens. Actuat. A 88 133
[3] Carvou E, Bihan F L, Rogel R and Bonnaud O 2002 Sens. Proc. IEEE 2 804
[4] Carvou E, Bihan F L, Rogel R and Bonnaud O 2004 IEEE Sens. J. 4 597
[5] Jacques E, Bihan F L, Crand S and Brahim T M 2006 The 32nd Annual Conference on IEEE Industrial Electronics (Paris, Franch 6–10 November 2005) p3193
[6] Yamaguchi Y, Hashimoto H and Kimura M 2010 IEEE Electron Device Lett. 11 1260
[7] Kimura M, Yamaguchi Y, Hashimoto H and Hirako M 2010 Electrochem. Solid-State Lett. 8 J96
[8] Li S J, He X, Han D D, Sun L, Wang Y, Han R Q, Chan M S and Zhang S D 2012 Chin. Phys. Lett. 29 018501
[9] Zheng G G, Xian F L and Li X Y 2011 Chin. Phys. Lett. 28 054213
[10] Pan F, Qian X R, Huang L Z, Wang H B and Yan D H 2011 Chin. Phys. Lett. 28 078504
[11] Zhao X F and Wen D Z 2009 J. Semicond. 30 114002
[12] Chen X Y, Shen W Z and He Y L 2005 J. Appl. Phys. 97 024305
[13] Chen X Y, Shen W Z, Chen H, Zhang R and He Y L 2006 Nanotechnology 17 595
Viewed
Full text


Abstract