| FUNDAMENTAL AREAS OF PHENOMENOLOGY(INCLUDING APPLICATIONS) |
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Bonding Interface Imaging and Shear Strength Prediction by Ultrasound |
LI Yong-An, MAO Jie, WANG Xiao-Min, LI Ming-Xuan, AN Zhi-Wu, ZHUANG Qiao |
| State Key Laboratory of Acoustics, Institute of Acoustics, Chinese Academy of Sciences, Beijing 100190 |
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| Cite this article: |
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LI Yong-An, MAO Jie, WANG Xiao-Min et al 2010 Chin. Phys. Lett. 27 064303 |
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Abstract The propagation of a longitudinal ultrasonic wave normally incident upon an adhesively bonded structure is studied. The structure consists of adherend and adhesive layers with finite thickness. Interfaces between adherend and adhesive are regarded as distributed springs. Theoretical and experimental results show that resonant frequencies of the bonded structure vary sensitively with the interface stiffness constants and adhesive thickness, and these interface characteristics are inversed by the simulation annealing (SA) method. Furthermore, the distribution image of interface stiffnesses is compared with the state of fracture interface, and quantitative prediction of shear strength is achieved based on the distribution of interface stiffnesses and adhesive thicknesses by using a back-propagation neutral network. The average relative error of the shear strength from prediction to real value is 10.7%.
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| Keywords:
43.35.Yb
43.60.Lq
43.35.Cg
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Received: 25 January 2010
Published: 25 May 2010
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| PACS: |
43.35.Yb
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(Ultrasonic instrumentation and measurement techniques)
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43.60.Lq
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(Acoustic imaging, displays, pattern recognition, feature extraction)
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43.35.Cg
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(Ultrasonic velocity, dispersion, scattering, diffraction, and Attenuation in solids; elastic constants)
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